Reducing size of liquid cooling systems has been a challenge for companies in the electronics cooling industry for many years. Fujitsu introduces a 1mm thick liquid cooling heat pipe for compact electronic devices such as smartphones and tablets.
Consumers constantly feel their smartphones and tablets become hot after continuous use and Fujitsu believes its new heat pipe will solve this problem. The heat pipe can transfer more than five times the heat than current heat pipes in the industry.
“The miniature heat pipe is a closed system comprising of an evaporator and a condenser. The evaporator will sit closer to a hot spot (CPU or GPU) and the condenser would be located at a relatively cooler section of the phone. Tiny pipes will connect the two to form a closed loop. The evaporator has six perforated sheets of copper, each about 0.1mm thick. The heat from the hotspot causes the liquid to vaporise and the vapor line will carry these vapors to the condenser where the lower temperature causes the vapours to condense back to liquid state and release heat energy in the process. The liquid moves in the system through capillary action which makes the orientation of the smartphone irrelevant,” according to Fujitsu.